T - R A M

Example

P/N: TZ136C36KA-25Q-B

36Mb x36 Zt SRAM, Common I/O, Pipelined Read,
Single Data Rate, Late-Late-Write, 250MHz, 2.5V/2.5V,
100p TQFP, Commercial, Bulk

For a printable copy of our Part Number Decoder, please click the hyperlink below.

Part Number Decoder

Company Identification

T=T-RAM

Function :

The product function is an 8 bit hex value made up of the following characters,

Bit[1:0]
00 = Not Applicable
01 = PL
10 = FT
11 = PL/FT

Bit[3:2]
00 = Not Applicable
01 = SCD
10 = DCD
11 = SCD/DCD Programmable

Bit[5:4]
00 = Not Applicable
01 = 1 CS
10 = 2 CS
11 = 3 CS

Bit[6]
0 = No JTAG
1 = JTAG

Bit[7]
Reserved

Density :

09 = 8Mb or 9Mb
18 = 16M or 18M
36 = 32M or 36M
72 = 64M or 72M
14 = 128M or 144M
28 = 256M or 288M
57 = 512M or 576M
01 = 1024M or 1152M
02 = 2048M or 2304M

I/O Type

C = CIO

S = SIO

Data Width

08 = x8
09 = x9
18 = x18
32 = x32
36 = x36
72 = x72
14 = x144

V_DD/V_DDQ/Logic/Comment :

A = 2.5V/1.9V/HSTL/Extended
B = 2.5V/1.5V/HSTL
C = 1.8V/1.8V/HSTL/Extended
D = 1.8V/1.5V/HSTL
E = 1.5V/1.5V/HSTL
F = 1.5V/1.2V/HSTL
G = 1.2V/1.2V/HSTL
H = 3.3V/3.3V-2.5V CMOS
J = 3.3V/2.5V CMOS
K = 2.5V/2.5V CMOS
L = 2.5V/1.8V CMOS
M = 2.5V/1.5V CMOS
N = 1.8V/1.8V CMOS
P = 1.8V/1.5V CMOS
Q = 1.5V/1.5V CMOS

Die Revision:

A = 1st Die Revision

B = 2nd Die Revision

C = 3rd Die Revision

Speed Bin :

10 = 100MHz
12 = 120MHz
13 = 130MHz
15 = 150MHz
16 = 167MHz
20 = 200MHz
22 = 225MHz
25 = 250MHz
27 = 275MHz
30 = 300MHz
33 = 333MHz
35 = 350MHz
37 = 375MHz
40 = 400MHz
45 = 450MHz
50 = 500MHz

Package Type :

D = Die
A = 119 BGA
B = 153 BGA
C = 165 BGA
E = 209 BGA
F = 221 BGA
Q = 100 TQFP

Part Specific ID :

X = Lead Free Package

O = Regular Package

Packaging :

B = Bulk

T = Tape and Reel

E = Engineering Sample

M = Mechanical Sample

Q = Qualification Sample

Architecture :

D = DDR

Q = QDR

P = Pipelined Burst

Z = Zero-turnaround (Zt)

S = Sigma SRAM